Abstract
Here we describe the electroless deposition of Cu-Ag alloys in deep eutectic solvents using a variety of electrochemical and surface analysis techniques to determine the mechanism of alloy deposition and composition of deposits. The influence of various conditions on electroless deposition and the morphology of the deposit layers have been investigated by scanning electron microscopy (SEM) with energy dispersive analysis by X-rays (EDX). The electrochemical behaviour of pure copper, pure silver and Cu-Ag alloys was studied at various working electrodes by cyclic voltammetry. The use of (EQCM) electrochemical quartz crystal microbalance is shown to be very dependent upon the concentration of ions in solution. the cathodic current efficiency for the deposition of Cu-Ag alloys is about 99%.